Inventions in Flat Pack Electronic Device category

Introduction

Flat Pack Electronic Device is one of those areas that honestly has a lot of new inventions coming up almost every day. Of course, quality is more important than quantity but dont' forget about the element of chance. In higher sample size there is that higher probablity of somethign useful coming up.

Patented Inventions in Flat Pack Electronic Device

  1. Sealing structure for highly moisture-sensitive electronic device element ...

    Here are few examples in this category: A Sealing structure for highly moisture-sensitive electronic device element ..., which seems to be dated Fri, 21 Sep 2001 00:00:00 -0700. This one is quite interesting for Flat Pack Electronic Device category. First of all it is very futuristic; I guess everything new that is invented has to be in one way or another futuristic. Anyways, the point here is that this invention has some good potential for future. Inventors of this project were Eastman Kodak Company. The idea behind the it is very odd in a good way.

    Let’s say see what the actual authors say about them: ... [0062] (2) a 150 nm thick organic hole-transporting layer of 4,4'-bis-[N-(l- naphthyl)-N-phenylamino]bi- phenyl (NPB) was formed over the substrate and ....

    Here is its drawing Sealing structure for highly moisture-sensitive electronic device element ...

  3. Coplanar corrector ring

    Here are few examples in this category: A Coplanar corrector ring, which seems to be dated Sun, 13 Oct 1991 00:00:00 -0700. This one is quite interesting for Flat Pack Electronic Device category. First of all it is very futuristic; I guess everything new that is invented has to be in one way or another futuristic. Anyways, the point here is that this invention has some good potential for future. Inventors of this project were VLSI Technology, Inc.. The idea behind the it is very odd in a good way.

    Let’s say see what the actual authors say about them: 3 BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of ....

    Here is its drawing Coplanar corrector ring

  5. Semiconductor module with high process accuracy, manufacturing method ...

    Here are few examples in this category: A Semiconductor module with high process accuracy, manufacturing method ..., which seems to be dated Tue, 07 Jun 2005 00:00:00 -0700. This one is quite interesting for Flat Pack Electronic Device category. First of all it is very futuristic; I guess everything new that is invented has to be in one way or another futuristic. Anyways, the point here is that this invention has some good potential for future. Inventors of this project were Sanyo Electric Co., Ltd.. The idea behind the it is very odd in a good way.

    Let’s say see what the actual authors say about them: 1 2 SEMICONDUCTOR MODULE WITH HIGH According to the present invention, a semiconductor mod- PROCESS ACCURACY, MANUFACTURING ule includes a insulating resin ....

    Here is its drawing Semiconductor module with high process accuracy, manufacturing method ...

  7. Multilayer wiring board having vent holes and method of making

    Here are few examples in this category: A Multilayer wiring board having vent holes and method of making, which seems to be dated Mon, 20 Jun 1994 00:00:00 -0700. This one is quite interesting for Flat Pack Electronic Device category. First of all it is very futuristic; I guess everything new that is invented has to be in one way or another futuristic. Anyways, the point here is that this invention has some good potential for future. Inventors of this project were Hitachi, Ltd.. The idea behind the it is very odd in a good way.

    Let’s say see what the actual authors say about them: FIG..

    Here is its drawing Multilayer wiring board having vent holes and method of making


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Searching inventions by utalizing United States Patent classification and Google patent search.

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